Micross Supplies Bare Die, Wafer Form, Chip Level Passive and Packaged Parts

Electro-mechanical and Semiconductors
Bare Die, Passives and Packaged Parts

Micross is a global provider of specialist Semiconductor Package Assembly and distributed products such as Bare Die, Wafers, Capacitors, Resistors and many more for the electronics community. We are a supplier and manufacturer of solutions for high reliability and state-of-the-art electronic applications which span across space, military, commercial, industrial and hi rel markets.

We represent a single source for specialty electronics able to provide leadership in the design, manufacture, logistics and distribution processes necessary to realise and support an application from start to finish.

Component Distribution Division

Micross is an approved specialist semiconductor distributor focusing on leading edge high reliability and high performance electronic applications. Our fields of expertise range from harsh environment products for high temperature, vibration or radiation exposures through to highest efficiency industrial power modules and highest performance Commercial Audio Components. Our component expertise covers a full range of assembly technology such as Silicon Die and Passive Chip Level Components for use in LTCC or thick film hybrid circuits or multi-chip-modules through to Plastic Encapsulated Active Semiconductors for PCBs and SMT (Surface Mount Technology). Other key areas of this division are Wafer Processing and Testing, Obsolescence Management and Die Storage or Banking Services Above all our core focus in every market sector or product family is on reliability, on-site technical support and Quality.

Manufactured Products and Services Division

Micross is a specialist in hi-reliability microelectronics component assembly and integration. The division has a pedigree dating back 40 years and a high level of recognition in communities such as space and military electronics. The aim of the products & services division is to provide a single solution to a customer’s needs whether semiconductor or electro-mechanical. The Electro Mechanical sub division has extensive capabilities in Component Repair and Value Added Services such as BGA Reballing, Solder Exchange, Automated Dipping and PCB Reworking. The Semiconductor sub division manufactures parts such as Ceramic, Hermetic and many more package types including Custom Package Designs.


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June 2011

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June 2011

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